Baku BK-223 Soldering Flux Paste
High effect of help soldering. Wont corrode IC and PCB. Lead free,environmental and makes no smoke. Suit for the precision chip of mobile phone,PCB card.
The BK-223 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
These flux paste are specially formula for BGA reballing / balls works, they not only stick the balls much more well then regular flux, but also provide easy bonding with component pad to balls with typical oven profile.
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