Description
IPHONE X/XS/XS MAX فقط
Product Features
–BGA Reballing Platform for iPhone X/XS/XS MAX –Material : Metal. –Precision Positioning. Step1:Put the motherboard that needstin planting into the tin planting card slot Step2: Put the BGA Stencil Match the corresponding location Step3:Use Tin Scraping Knife put solder paste into the mesh of the black net Step4: Remove the black net and use a hot air gun to blow the solder paste until it melts