YCS Solder Paste 183 ℃ PCB BGA CPU Tin Planting Flux

YCS 50g Solder Paste 138℃ 150℃ 183℃ 199℃ 215℃ paste flux for Mobile Phone PCB BGA CPU welding repairs. YCS high-quality high temperature, medium temperature and low temperature solder paste achieves a perfect balance between fluidity and stability, ensuring precise solder ball placement and soldering.

Features:
1. YCS high-quality high temperature, medium temperature and low temperature solder paste is suitable for BGA, IC, CPU and PCB precision soldering repair.
2. Excellent anti-oxidation performance, uniform and delicate. Strong wettability, excellent performance, soldering desoldering repair.
3. Portable size, compact 50g packaging makes the solder paste easy to handle and transport, suitable for repair at any time.
4. Widely used, perfect for mobile phone motherboard repair, this solder paste is a must-have for electronic technicians.
5. Complete set, the YCS tool set includes essential soldering tools, making it a comprehensive solution for soldering tasks.
6. The best viscosity is 138 183 158, no collapse and no offset, the solder paste is viscous and smooth, the viscosity changes little, and the chip components are not easy to offset.
7. The solder joints are bright and full, high resistance, strong activity, easy to weld, and not prone to poor welding or false welding.
8. Designed for ease of use, this solder paste simplifies the soldering process, making it suitable for beginners and professionals.

Product Parameters:
YCS 183℃ Medium Temperature Tin Paste.
Scope of application: Engineering circuit maintenance, computer welding, PCBA welding, SMT patch, mobile phone motherboard welding, electrical appliance maintenance.