Bristle/Superfine steel wire/Clean/Remove glueMobile phone repair double-headed dual-use hard brushHard disk welding special brushCleaning the circuit board IC brushGood cleaning effectAnti-static designNo lintDurableWide range of applicationsSuitable for mobile phone repair IC pad cleaning / motherboard removal glue, etc.Remove glue from mobile phone motherboardElectronic components cleaningComputer motherboard glue removalClean up the dustCleaning the motherboardExcellent cleaning effect, no deformation, no hair loss, durableOne brush for dual use, double head for dual useAnti-static bristles/superfine wire brush
Bristle/Superfine steel wire/Clean/Remove glueMobile phone repair double-headed dual-use hard brushHard disk welding special brushCleaning the circuit board IC brushGood cleaning effectAnti-static designNo lintDurableWide range of applicationsSuitable for mobile phone repair IC pad cleaning / motherboard removal glue, etc.Remove glue from mobile phone motherboardElectronic components cleaningComputer motherboard glue removalClean up the dustCleaning the motherboardExcellent cleaning effect, no deformation, no hair loss, durableOne brush for dual use, double head for dual useAnti-static bristles/superfine wire brush
Elasticity is more toughness, high temperature resistance, no deformation, no sticky tin,Can quickly separate tin point.27 blades + 1 handleRepair BGA chipThinner than tin pointAir gun temperature should be between 340 and 360,Wind speed between 28-30New upgraded version
Elasticity is more toughness, high temperature resistance, no deformation, no sticky tin,Can quickly separate tin point.27 blades + 1 handleRepair BGA chipThinner than tin pointAir gun temperature should be between 340 and 360,Wind speed between 28-30New upgraded version
