Product details
Sold out
XZZ L2023 Intelligent Desoldering Station for iPhone X – 15 Pro Max Android Motherboard IC Chip BGA Stencil Phone Repair Tools
Rated 0 out of 5
0 Reviews
Out of stock
24,500 د.ج
- Estimated delivery time 1-3 days
- If you have any problem, Please contact us Sat-Thu 08:00 to 15:00.
- Contact Number 0560 119 487
Related products
MECHANIC iTEST Pro Battery Charging Detection Kit from 7 to 11 PM only
RELIFE RL-101B IC Glue Removing Tools
650 د.ج
Contains 7 different shapes of blades, suitable for various operations with different needs
Carver set
Suitable for removing glue, edge cleaning, chip removal, scraping pads, safe disassembly of main board parts, etc. of mobile phone motherboards
Quick repair
Double-head dual-use
Safe and efficient
Low center of gravity is more stable
Newly upgraded handle, good feel, ergonomic, low center of gravity, more stable (the grip is heavier, and the center of gravity moves down more stable)
High-strength alloy steel
The blade is forged from high-toughness alloy steel and refined by high temperature quenching many times. It is hard and durable, not easy to collapse.
Diamond texture, non-slip design
Exquisite diamond-shaped texture anti-skid design, comfortable hand feeling, drop resistance and abrasion resistance
Double cross chuck for firm clamping
Hold the blade firmly, use multi-turn screw heads, the blade is easy to install and tighten, and there is no sense of shaking in use
Wide range of applications
Contains 7 different shapes of blades, suitable for operations of various needs, suitable for removing glue, edge cleaning, chip removal, scraping pads, safe removal of main board parts, etc.
Contiene 7 formas diferentes de hojas, adecuadas para operaciones de diversas necesidades, adecuadas para eliminar pegamento, limpieza de bordes, eliminación de virutas, 15#
ETA6953 Original Charge IC for Redmi 9A
Mechanic Power Pro 18in1 Mobile Phone Power Test Cable for Android
3,400 د.جMechanic Power Pro 17in1 mobile phone power test cable for Android - Input: 3.7-5V/0-3A. Designed for Android for models: Huawei, Samsung, Xiaomi, Glory, OPPO, VIVO, Meizu, Redmi, ZTE, LG, Mito,LeTV, Lenovo, Hisense, ACRE, Nnbia, Nokia, One Plus, Jinli, Cool, Sony, HTC, Blackberry, Philips, Sharp, etc. over 2000 models.
- Flexible FPC so there is no constraint of hard PCB board.
- The opening makes it easy to use and store, thanks to which the stand is tidy.
- Thick copper wire core, small resistance value, more accurate data detection.
- High-density wire body, strong flexibility, no cracking and wear resistance.
- Precisely matched motherboard battery button to reduce mobile phone maintenance risk.
- Applies to Android phones
