KATEX KATEX KT-3.0/1.5M DESOLDERING WICK

The KATEX KT-3.0/1.5M Desoldering Wick is a high-performance copper braid used for removing excess solder from PCB pads, IC chips, and BGA components. It is an essential consumable for cleaning motherboards during electronics repair.

Key Specifications

• Width (3.0mm): A medium-width braid that is highly versatile. It is wide enough to quickly clean larger pads (like those on a charging port) while still being precise enough for smaller SMD components.

• Length (1.5 Meters): Provided on a compact, handheld dispenser spool that allows for easy application and prevents contamination of the unused wick.

• Material: Made of high-quality oxygen-free copper wire woven into a fine braid.

• Flux Coating: Pre-coated with a non-corrosive RMA (Rosin Mildly Activated) flux to enhance suction and speed up the solder absorption process.

Performance Benefits

• Powerful Absorption: The flat braid design uses capillary action to “wick” molten solder away from the board, leaving a clean, flat surface for new components.

• Thermal Efficiency: Rapidly transfers heat to the solder without overheating the delicate copper traces on the motherboard, reducing the risk of “lifted pads.”

• Low Residue: Formulated to leave minimal flux residue, which helps maintain a professional finish and reduces the time needed for cleaning with isopropyl alcohol.