Product details
XZZ TR17 4-in-1 Middle Layer BGA Reballing Stencil Platform for iPhone 17 / 17 Pro / 17Pro Max / 17 Air
The Motherboard shown in the image is for reference only. The actual package does not contain any Motherboard!!!
Step-by-step demonstration:
- Put the tinning table into the magnetic base, and fix the motherboard that needs to be tinned in the corresponding slot of the tinning table
- Please take out the corresponding tinning stencil and place it in the tinning table to align with the lamination
- Use the tin scraper to apply the solder paste evenly in the mesh of the tinning net
- Remove the stencil, and then use a hot air gun to heat and blow until the solder paste melts
Package includes:
- 1 x Positioning Plate
- 4 x Stencil
