XZZ TR17 4-in-1 Middle Layer BGA Reballing Stencil Platform for iPhone 17 / 17 Pro / 17Pro Max / 17 Air

XZZ TR17 4-in-1 Middle Layer BGA Reballing Stencil Platform for iPhone 17 / 17 Pro / 17Pro Max / 17 Air

The Motherboard shown in the image is for reference only. The actual package does not contain any Motherboard!!!

Step-by-step demonstration:

• Put the tinning table into the magnetic base, and fix the motherboard that needs to be tinned in the corresponding slot of the tinning table

• Please take out the corresponding tinning stencil and place it in the tinning table to align with the lamination

• Use the tin scraper to apply the solder paste evenly in the mesh of the tinning net

• Remove the stencil, and then use a hot air gun to heat and blow until the solder paste melts

Package includes:

• 1 x Positioning Plate

• 4 x Stencil