-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
M-Triangel MT12 Automatic 4 in 1 Vacuum OCA Laminating and Air Bubble Removing Machine
159,000 د.ج159,000 د.ج× -
“AMAOE HW10 Huawei BGA Reballing Stencil” has been added to your cart. View cart
AMAOE F700F Middle Frame BGA Reballing Stencil
Rated 0 out of 5
0 Reviews
In stock
800 د.ج Original price was: 800 د.ج.400 د.جCurrent price is: 400 د.ج.
- Estimated delivery time 1-3 days
- If you have any problem, Please contact us Sat-Thu 08:00 to 15:00.
- Contact Number 0560 119 487
Related products
WELSOLO VS05 PMIC Universal BGA Stencil
WELSOLO VS05 PMIC Universal BGA Stencil
AMAOE HI1 Huawei BGA Reballing Stencil
AMAOE SU2 SPREADTRUM Reballing BGA Stencil
AMAOE STENCIL QUALCOMM/MTK CPU MQ3
AMAOE Stencil Qualcomm/MTK CPU MQ3
AMAOE OP1 BGA Reballing Stencil for OPPO VIVO
Amaoe BGA Stencil OP1 OP2 MSM8976/MSM8956 SDM660 CPU For OPPO R11 R9P/SP Chip IC
AMAOE HW9 Huawei BGA Reballing Stencil
for Honor8X/20i/Nova5i